Image sensor and electronic device including the same

ABSTRACT

An electronic device may include at least one image sensor that includes a plurality of photo-sensing devices, a photoelectric device on one side of the semiconductor substrate and configured to selectively sense first visible light, and a plurality of color filters on separate photo-sensing devices. The plurality of color filters may include a first color filter configured to selectively transmit a second visible light that is different from the first visible light and a second color filter transmitting first mixed light including the second visible light. The electronic device may include multiple arrays of color filters. The electronic device may include different photoelectric devices on the separate arrays of color filters. The different photoelectric devices may be configured to sense different wavelength spectra of light.

RELATED APPLICATIONS

This application claims priority to and the benefit of Korean PatentApplication No. 10-2015-0161884 filed in the Korean IntellectualProperty Office on Nov. 18, 2015, the entire contents of which areincorporated herein by reference.

BACKGROUND

1. Field

Example embodiments relate to image sensors and electronic devicesincluding the same.

2. Description of the Related Art

An imaging device is used in a digital camera and a camcorder, etc., tocapture an image and to store it as an electrical signal. The imagingdevice may include an image sensor that separates incident light intoseparate components according to a wavelength and converts eachcomponent to a separate electrical signal.

There has been an ongoing demand for reduction in the size of the imagesensor. Recently, in order to reduce the image sensor size, an imagesensor having a stacking structure has been researched.

SUMMARY

Some example embodiments provide an image sensor having a novelstructure which may be configured to sense light with improved lightabsorption efficiency and sensitivity.

Some example embodiments provide an electronic device including theimage sensor.

According to some example embodiments, an image sensor may include asemiconductor substrate including a plurality of photo-sensing devices,a photoelectric device on the semiconductor substrate and configured toselectively sense a first visible light, the first visible lightincluding light in a first wavelength spectrum, and a plurality of colorfilters on the plurality of photo-sensing devices, each of the colorfilters being on a separate photo-sensing device of the plurality ofphoto-sensing devices, the plurality of color filters including a firstcolor filter configured to selectively transmit second visible light,the second visible light including light in a second wavelengthspectrum, the second wavelength spectrum being different from the firstwavelength spectrum, and a second color filter configured to transmit afirst mixed light, the first mixed light including light in the secondwavelength spectrum and light in a third wavelength spectrum, the thirdwavelength spectrum being different from the second wavelength spectrum.

In some example embodiments, the plurality of color filters may includea color filter array, the color filter array including a quantity offirst color filters and a quantity of second color filters, the quantityof first color filters may include at least one first color filter, thequantity of second color filters may include at least one second colorfilter, and the quantity of second color filters may be equal to orgreater than the quantity of first color filters.

In some example embodiments, the plurality of photo-sensing devices mayinclude a first photo-sensing device overlapping with the first colorfilter and configured to sense the second visible light, and a secondphoto-sensing device overlapping with the second color filter andconfigured to sense a second mixed light, the second mixed lightincluding the second visible light.

In some example embodiments, the second mixed light and the first mixedlight may have a common wavelength spectrum, and each of the first mixedlight and the second mixed light excludes the first visible light.

In some example embodiments, each of the first mixed light and thesecond mixed light may include at least one of a mixture of blue lightand green light, and a mixture of red light and green light.

In some example embodiments, the first mixed light may include the firstvisible light, and the second mixed light excludes the first visiblelight.

In some example embodiments, each of the first mixed light and thesecond mixed light may include green light.

In some example embodiments, the first mixed light may include a mixtureof red light, green light, and blue light, and the second mixed lightmay include at least one of a mixture of blue light and green light, anda mixture of red light and green light.

In some example embodiments, the second visible light includes bluelight, and the second mixed light includes a mixture of blue light andgreen light.

In some example embodiments, the second visible light may include redlight, and the second mixed light includes a mixture of red light andgreen light.

In some example embodiments, the first photo-sensing device may have afirst thickness, the second photo-sensing device has a second thickness,and the first thickness is different from the second thickness.

In some example embodiments, the second thickness may be greater thanthe first thickness.

In some example embodiments, the first visible light may include atleast one of red light and blue light.

In some example embodiments, the first visible light includes red lightand the second visible light includes blue light.

In some example embodiments, the first visible light may include bluelight and the second visible light includes red light.

In some example embodiments, the first mixed light includes a mixedlight, the mixed light including at least the first visible light.

In some example embodiments, the first mixed light may include a mixedlight, the mixed light including red light, green light, and blue light.

In some example embodiments, the first mixed light may include a mixedlight, the mixed light excluding the first visible light.

In some example embodiments, the photoelectric device may include a pairof electrodes, the electrodes facing each other, and a light absorptionlayer between the pair of electrodes, the light absorption layer beingconfigured to selectively absorb the first visible light.

According to some example embodiments, an electronic device may includean image sensor. The image sensor may include a semiconductor substrateincluding a plurality of photo-sensing devices, a photoelectric deviceon the semiconductor substrate and configured to selectively sense afirst visible light, the first visible light including light in a firstwavelength spectrum, and a plurality of color filters on the pluralityof photo-sensing devices, each of the color filters being on a separatephoto-sensing device of the plurality of photo-sensing devices, theplurality of color filters including a first color filter configured toselectively transmit second visible light, the second visible lightincluding light in a second wavelength spectrum, the second wavelengthspectrum being different from the first wavelength spectrum, and asecond color filter configured to transmit a first mixed light, thefirst mixed light including light in the second wavelength spectrum andlight in a third wavelength spectrum, the third wavelength spectrumbeing different from the second wavelength spectrum.

According to some example embodiments, an image sensor may include atleast first and second arrays of photo-sensing devices, at least firstand second arrays of color filters on separate, respective ones of thefirst and second arrays of photo-sensing devices, each array of colorfilters including at least two color filters configured to selectivelytransmit at least two separate wavelength spectra of light, and at leastone photoelectric device on the first and second arrays of colorfilters, the at least one photoelectric device being configured toselectively sense a wavelength spectrum of light that is different fromthe at least two separate light wavelength spectra of light.

In some example embodiments, the at least one photoelectric device mayinclude first and second photoelectric devices on separate, respectiveones of the first and second arrays of color filters, the first andsecond photoelectric devices being configured to selectively sensedifferent wavelength spectra of light.

In some example embodiments, the first color filter array may include aquantity of first color filters and a quantity of second color filters,the second plurality of filters may include a second color filter array,and the second color filter array may include at least a quantity ofthird color filters.

In some example embodiments, the second color filter array may include aquantity of second color filters.

In some example embodiments, the second color filter array may include aquantity of fourth color filters.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features of inventive concepts will be apparentfrom the more particular description of non-limiting embodiments ofinventive concepts, as illustrated in the accompanying drawings in whichlike reference characters refer to like parts throughout the differentviews. The drawings are not necessarily to scale, emphasis instead beingplaced upon illustrating principles of inventive concepts. In thedrawings:

FIG. 1 is a schematic cross-sectional view of an image sensor accordingto some example embodiments,

FIG. 2 is a schematic cross-sectional view of an image sensor accordingto some example embodiments,

FIG. 3, FIG. 4, FIG. 5, and FIG. 6 are schematic views respectivelyshowing various unit color filter arrays in an image sensor according tosome example embodiments,

FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 12, FIG. 13, FIG. 14,FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, FIG. 20, FIG. 21, and FIG.22 are schematic views respectively showing examples of disposing aphotoelectric device and a color filter layer in an image sensoraccording to some example embodiments,

FIG. 23 and FIG. 24 are schematic views showing disposition of a colorfilter layer in a non-stacked image sensor according to some exampleembodiments,

FIG. 25 shows an image sensor that includes multiple arrays of colorfilters according to some example embodiments, and

FIG. 26 shows an image sensor that includes multiple arrays of colorfilters and multiple photoelectric devices according to some exampleembodiments.

DETAILED DESCRIPTION

One or more example embodiments will be described in detail withreference to the accompanying drawings. Example embodiments, however,may be embodied in various different forms, and should not be construedas being limited to only the illustrated embodiments. Rather, theillustrated embodiments are provided as examples so that this disclosurewill be thorough and complete, and will fully convey the concepts ofthis disclosure to those skilled in the art. Accordingly, knownprocesses, elements, and techniques, may not be described with respectto some example embodiments. Unless otherwise noted, like referencecharacters denote like elements throughout the attached drawings andwritten description, and thus descriptions will not be repeated.

Although the terms “first,” “second,” “third,” etc., may be used hereinto describe various elements, components, regions, layers, and/orsections, these elements, components, regions, layers, and/or sections,should not be limited by these terms. These terms are only used todistinguish one element, component, region, layer, or section, fromanother region, layer, or section. Thus, a first element, component,region, layer, or section, discussed below may be termed a secondelement, component, region, layer, or section, without departing fromthe scope of this disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. For example, if the device inthe figures is turned over, elements described as “below,” “beneath,” or“under,” other elements or features would then be oriented “above” theother elements or features. Thus, the example terms “below” and “under”may encompass both an orientation of above and below. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly. Inaddition, when an element is referred to as being “between” twoelements, the element may be the only element between the two elements,or one or more other intervening elements may be present.

As used herein, the singular forms “a,” “an,” and “the,” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups, thereof. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. Expressions such as “at least one of,” when preceding alist of elements, modify the entire list of elements and do not modifythe individual elements of the list. Also, the term “exemplary” isintended to refer to an example or illustration.

When an element is referred to as being “on,” “connected to,” “coupledto,” or “adjacent to,” another element, the element may be directly on,connected to, coupled to, or adjacent to, the other element, or one ormore other intervening elements may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to,”“directly coupled to,” or “immediately adjacent to,” another elementthere are no intervening elements present.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and/or this disclosure, and should notbe interpreted in an idealized or overly formal sense unless expresslyso defined herein.

Example embodiments may be described with reference to acts and symbolicrepresentations of operations (e.g., in the form of flow charts, flowdiagrams, data flow diagrams, structure diagrams, block diagrams, etc.)that may be implemented in conjunction with units and/or devicesdiscussed in more detail below. Although discussed in a particularlymanner, a function or operation specified in a specific block may beperformed differently from the flow specified in a flowchart, flowdiagram, etc. For example, functions or operations illustrated as beingperformed serially in two consecutive blocks may actually be performedsimultaneously, or in some cases be performed in reverse order.

Units and/or devices according to one or more example embodiments may beimplemented using hardware, software, and/or a combination thereof. Forexample, hardware devices may be implemented using processing circuitrysuch as, but not limited to, a processor, Central Processing Unit (CPU),a controller, an arithmetic logic unit (ALU), a digital signalprocessor, a microcomputer, a field programmable gate array (FPGA), aSystem-on-Chip (SoC), an application-specific integrated circuit (ASIC),a programmable logic unit, a microprocessor, or any other device capableof responding to and executing instructions in a defined manner.

Software may include a computer program, program code, instructions, orsome combination thereof, for independently or collectively instructingor configuring a hardware device to operate as desired. The computerprogram and/or program code may include program or computer-readableinstructions, software components, software modules, data files, datastructures, and/or the like, capable of being implemented by one or morehardware devices, such as one or more of the hardware devices mentionedabove. Examples of program code include both machine code produced by acompiler and higher level program code that is executed using aninterpreter.

For example, when a hardware device is a computer processing device(e.g., a processor, Central Processing Unit (CPU), a controller, anarithmetic logic unit (ALU), a digital signal processor, amicrocomputer, a microprocessor, etc.), the computer processing devicemay be configured to carry out program code by performing arithmetical,logical, and input/output operations, according to the program code.Once the program code is loaded into a computer processing device, thecomputer processing device may be programmed to perform the programcode, thereby transforming the computer processing device into a specialpurpose computer processing device. In a more specific example, when theprogram code is loaded into a processor, the processor becomesprogrammed to perform the program code and operations correspondingthereto, thereby transforming the processor into a special purposeprocessor.

Software and/or data may be embodied permanently or temporarily in anytype of machine, component, physical or virtual equipment, or computerstorage medium or device, capable of providing instructions or data to,or being interpreted by, a hardware device. The software also may bedistributed over network coupled computer systems so that the softwareis stored and executed in a distributed fashion. In particular, forexample, software and data may be stored by one or more computerreadable recording mediums, including the tangible or non-transitorycomputer-readable storage media discussed herein.

According to one or more example embodiments, computer processingdevices may be described as including various functional units thatperform various operations and/or functions to increase the clarity ofthe description. However, computer processing devices are not intendedto be limited to these functional units. For example, in one or moreexample embodiments, the various operations and/or functions of thefunctional units may be performed by other ones of the functional units.Further, the computer processing devices may perform the operationsand/or functions of the various functional units without sub-dividingthe operations and/or functions of the computer processing units intothese various functional units.

Units and/or devices according to one or more example embodiments mayalso include one or more storage devices. The one or more storagedevices may be tangible or non-transitory computer-readable storagemedia, such as random access memory (RAM), read only memory (ROM), apermanent mass storage device (such as a disk drive), solid state (e.g.,NAND flash) device, and/or any other like data storage mechanism capableof storing and recording data. The one or more storage devices may beconfigured to store computer programs, program code, instructions, orsome combination thereof, for one or more operating systems and/or forimplementing the example embodiments described herein. The computerprograms, program code, instructions, or some combination thereof, mayalso be loaded from a separate computer readable storage medium into theone or more storage devices and/or one or more computer processingdevices using a drive mechanism. Such separate computer readable storagemedium may include a Universal Serial Bus (USB) flash drive, a memorystick, a Blu-ray/DVD/CD-ROM drive, a memory card, and/or other likecomputer readable storage media. The computer programs, program code,instructions, or some combination thereof, may be loaded into the one ormore storage devices and/or the one or more computer processing devicesfrom a remote data storage device via a network interface, rather thanvia a local computer readable storage medium. Additionally, the computerprograms, program code, instructions, or some combination thereof, maybe loaded into the one or more storage devices and/or the one or moreprocessors from a remote computing system that is configured to transferand/or distribute the computer programs, program code, instructions, orsome combination thereof, over a network. The remote computing systemmay transfer and/or distribute the computer programs, program code,instructions, or some combination thereof, via a wired interface, an airinterface, and/or any other like medium.

The one or more hardware devices, the one or more storage devices,and/or the computer programs, program code, instructions, or somecombination thereof, may be specially designed and constructed for thepurposes of the example embodiments, or they may be known devices thatare altered and/or modified for the purposes of example embodiments.

A hardware device, such as a computer processing device, may run anoperating system (OS) and one or more software applications that run onthe OS. The computer processing device also may access, store,manipulate, process, and create data in response to execution of thesoftware. For simplicity, one or more example embodiments may beexemplified as one computer processing device; however, one skilled inthe art will appreciate that a hardware device may include multipleprocessing elements and multiple types of processing elements. Forexample, a hardware device may include multiple processors or aprocessor and a controller. In addition, other processing configurationsare possible, such as parallel processors.

Although described with reference to specific examples and drawings,modifications, additions and substitutions of example embodiments may bevariously made according to the description by those of ordinary skillin the art. For example, the described techniques may be performed in anorder different with that of the methods described, and/or componentssuch as the described system, architecture, devices, circuit, and thelike, may be connected or combined to be different from theabove-described methods, or results may be appropriately achieved byother components or equivalents.

Although corresponding plan views and/or perspective views of somecross-sectional view(s) may not be shown, the cross-sectional view(s) ofdevice structures illustrated herein provide support for a plurality ofdevice structures that extend along two different directions as would beillustrated in a plan view, and/or in three different directions aswould be illustrated in a perspective view. The two different directionsmay or may not be orthogonal to each other. The three differentdirections may include a third direction that may be orthogonal to thetwo different directions. The plurality of device structures may beintegrated in a same electronic device. For example, when a devicestructure (e.g., a memory cell structure or a transistor structure) isillustrated in a cross-sectional view, an electronic device may includea plurality of the device structures (e.g., memory cell structures ortransistor structures), as would be illustrated by a plan view of theelectronic device. The plurality of device structures may be arranged inan array and/or in a two-dimensional pattern.

Hereinafter, an image sensor according to some example embodiments isdescribed referring to drawings. Herein, a CMOS image sensor as anexample of an image sensor is described.

FIG. 1 is a schematic cross-sectional view showing an image sensoraccording to some example embodiments.

Referring to FIG. 1, an image sensor 200 according to some exampleembodiments includes a photoelectric device 30; a semiconductorsubstrate 110 including a plurality of photo-sensing devices 50 a and 50b, a charge storage 55 and a transmission transistor (not shown); and acolor filter layer 70.

The photoelectric device 30 is positioned at a light-incident side andmay selectively sense light in a first wavelength spectrum of light(hereinafter, referred to ‘first visible light’). The first visiblelight may be one of light of three primary colors.

The photoelectric device 30 includes a lower electrode 31 and an upperelectrode 33 facing each other and a light absorption layer 32 betweenthe lower electrode 31 and the upper electrode 33.

One of the lower electrode 31 and the upper electrode 33 is an anode andthe other is a cathode. At least one of the lower electrode 31 and theupper electrode 33 may be a light-transmitting electrode, and thelight-transmitting electrode may be made of, for example, a transparentconductor including indium tin oxide (ITO) or indium zinc oxide (IZO),or may be a metal thin layer having a thin thickness of severalnanometers or several tens of nanometers or a metal thin layer having athin thickness of several nanometers to several tens of nanometers dopedwith a metal oxide.

The light absorption layer 32 may selectively absorb the first visiblelight. The light absorption layer 32 may selectively absorb the firstvisible light but pass the rest of light except for the first visiblelight.

For example, the first visible light may be red light having awavelength spectrum with a maximum absorption wavelength (λ_(max)) in arange of greater than about 600 nm and less than or equal to about 700nm. Specifically, the first visible light may be red light having awavelength spectrum with a maximum absorption wavelength (λ_(max)) in arange of about 630 nm to about 680 nm.

In another example, the first visible light may be blue light having awavelength spectrum with a maximum absorption wavelength (λ_(max)) in arange of greater than or equal to about 400 nm to less than about 500nm. Specifically, the first visible light may be blue light having awavelength spectrum with a maximum absorption wavelength (λ_(max)) in arange of about 420 nm to about 480 nm within the range.

In another example, the first visible light may be green light having awavelength spectrum with a maximum absorption wavelength (λ_(max)) in arange of about 500 nm to about 600 nm. Specifically, the first visiblelight may be green light having a wavelength spectrum with a maximumabsorption wavelength (λ_(max)) in a range of about 520 nm to 580 nmwithin the range.

The light absorption layer 32 may include a p-type semiconductor and ann-type semiconductor, and the p-type semiconductor and the n-typesemiconductor may form a pn junction. The light absorption layer 32 mayselectively absorb the first visible light to generate excitons, thenthe generated excitons may be separated into holes and electrons, andthen separated holes transfer to an anode that is one of the lowerelectrode 31 and the upper electrode 33 and separated electrons transferto a cathode that is one of the lower electrode 31 and the upperelectrode 33 to provide a photoelectric effect. The separated electronsand/or holes may be collected in the charge storage 55.

At least one of the p-type semiconductor and the n-type semiconductormay selectively absorb first visible light. The p-type semiconductor andthe n-type semiconductor may independently include an organic material,an inorganic material, or an organic/inorganic material. At least one ofthe p-type semiconductor and the n-type semiconductor may include anorganic material.

The light absorption layer 32 may be a single layer or a multilayer. Thelight absorption layer 32 may be, for example an intrinsic layer (Ilayer), a p-type layer/I layer, an I layer/n-type layer, a p-typelayer/I layer/n-type layer, a p-type layer/n-type layer, and the like.

The intrinsic layer (I layer) may include the p-type semiconductor andthe n-type semiconductor in a volume ratio of about 1:100 to about100:1. The p-type semiconductor and the n-type semiconductor may bemixed in a volume ratio of about 1:50 to about 50:1, about 1:10 to about10:1, or about 1:1. When the p-type and n-type semiconductors have acomposition ratio within the range, an exciton may be effectivelyproduced and a pn junction may be effectively formed.

The p-type layer may include the p-type semiconductor, and the n-typelayer may include the n-type semiconductor.

The light absorption layer 32 may have a thickness of about 1 nm toabout 500 nm, for example, about 5 nm to about 300 nm or about 5 nm toabout 200 nm. Within the thickness range, the light absorption layer 32may effectively absorb first visible light, effectively separate holesfrom electrons, and deliver them, thereby effectively improvingphotoelectric conversion efficiency.

The light absorption layer 32 may be formed on the whole surface of theimage sensor image sensor 200. Thereby, as the first visible light maybe selectively absorbed on the whole surface of the image sensor, thelight absorption area may be increased to provide high light-absorptiveefficiency.

The semiconductor substrate 110 may be a silicon substrate, and may beintegrated with at least one of a first photo-sensing device 50 a, asecond photo-sensing device 50 b, a charge storage 55, and atransmission transistor (not shown).

The first photo-sensing device 50 a and the second photo-sensing device50 b may be a photodiode. The first photo-sensing device 50 a and thesecond photo-sensing device 50 b sense each light, and sensedinformation may be transferred by the transmission transistor. Thecharge storage 55 is electrically connected with the photoelectricdevice 30 and information of the charge storage 55 may be transferred bythe transmission transistor.

A metal wire (not shown) and a pad (not shown) are formed on the firstphoto-sensing device 50 a and the second photo-sensing device 50 b. Inorder to decrease signal delay, the metal wire and pad may be made of ametal having low resistivity, for example, aluminum (Al), copper (Cu),silver (Ag), and alloys thereof, but are not limited thereto. Further,it is not limited to the structure, and the metal wire and pad may bepositioned under the first photo-sensing device 50 a and the secondphoto-sensing device 50 b.

A lower insulation layer 60 and an upper insulation layer 80 are formedon the semiconductor substrate 110. The lower insulation layer 60 andthe upper insulation layer 80 may be made of an inorganic insulatingmaterial such as a silicon oxide and/or a silicon nitride, or a lowdielectric constant (low K) material such as SiC, SiCOH, SiCO, and SiOF.The lower insulation layer 60 and the upper insulation layer 80 have atrench 85 exposing the charge storage 55. The trench 85 may be filledwith fillers. At least one of the lower insulation layer 60 and theupper insulation layer 80 may be omitted.

The color filter layer 70 may include a plurality of unit color filterarrays repetitively arranged along with a matrix, and the unit colorfilter arrays may for example have various matrix arrangements of 2×2,3×3, 4×4, and the like.

The unit color filter array includes at least one first color filter 70a configured to selectively transmit one single wavelength spectrum oflight out of three primary colors and at least one second color filter70 b configured to selectively transmit a wavelength spectrum of mixedlight of at least two colors out of three primary colors.

The first color filter 70 a may selectively pass light in a secondwavelength spectrum (hereinafter, referred to ‘second visible light’)that is different from the first visible light, and may for example be ared filter configured to selectively transmit red light, a blue filterconfigured to selectively transmit blue light, or a green filterconfigured to selectively transmit green light.

For example, when the first visible light is red light, the first colorfilter 70 a may be a blue filter configured to selectively transmit bluelight having a wavelength spectrum with a maximum absorption wavelength(λ_(max)) in a range of greater than or equal to about 400 nm to lessthan or equal to about 500 nm or a green filter configured toselectively transmit green light having a wavelength spectrum with amaximum absorption wavelength (λ_(max)) in a range of about 500 nm toabout 600 nm.

In another example, when the first visible light is blue light, thefirst color filter 70 a may be a red filter configured to selectivelytransmit red light having a wavelength spectrum with a maximumabsorption wavelength (λ_(max)) in a range of greater than about 600 nmto less than or equal to about 700 nm or a green filter configured toselectively transmit green light having a wavelength spectrum with amaximum absorption wavelength (λ_(max)) in a range of about 500 nm toabout 600 nm.

In another example, when the first visible light is green light, thefirst color filter 70 a may be a blue filter configured to selectivelytransmit blue light having a wavelength spectrum with a maximumabsorption wavelength (λ_(max)) in a range of greater than or equal toabout 400 nm to less than or equal to about 500 nm or a red filterconfigured to selectively transmit red light having a wavelengthspectrum with a maximum absorption wavelength (λ_(max)) in a range ofgreater than about 600 nm to less than or equal to about 700 nm.

The second color filter 70 b may for example pass mixed light of atleast two selected from blue light, green light, and red light, forexample, mixed light of blue light and green light and thus may be, forexample, a cyan filter configured to selectively transmit mixed light ofblue light and green light, a yellow filter configured to selectivelytransmit mixed light of red light and green light, a magenta filterconfigured to selectively transmit mixed light of blue light and redlight, or a white filter configured to selectively transmit mixed lightof blue light, green light, and red light.

For example, the second color filter 70 b may pass mixed light includingthe second visible light.

In another example, the second color filter 70 b may pass mixed lightincluding the second visible light but excluding the first visiblelight.

In another example, the second color filter 70 b may pass mixed light oflight in a third visible ray region (hereinafter, referred to ‘thirdvisible light’), differing from the first visible light and the secondvisible light, and the second visible light.

In another example, the second color filter 70 b may pass mixed light ofthe first visible light, the second visible light, and the third visiblelight.

In another example, when the first visible light is red light, thesecond visible light is blue light, and the third visible light is greenlight, the second color filter 70 b may be a cyan filter configured toselectively transmit mixed light of the blue light and the green light.

In another example, when the first visible light is red light, thesecond visible light is blue light, and the third visible light is greenlight, the second color filter 70 b may be a white filter configured toselectively transmit mixed light of the blue light, the green light, andthe red light.

In another example, when the first visible light is red light, thesecond visible light is green light, and the third visible light is bluelight, the second color filter 70 b may be a cyan filter configured toselectively transmit mixed light of the blue light and the green light.

In another example, when the first visible light is red light, thesecond visible light is green light, and the third visible light is bluelight, the second color filter 70 b may be a white filter configured toselectively transmit mixed light of the blue light, the green light, andthe red light.

In another example, when the first visible light is blue light, thesecond visible light is red light, and the third visible light is greenlight, the second color filter 70 b may be a yellow filter configured toselectively transmit mixed light of the red light and the green light.

In another example, when first visible light is blue light, the secondvisible light is red light, and the third visible light is green light,the second color filter 70 b may be a white filter configured toselectively transmit mixed light of the red light, the green light, andthe blue light.

In another example, when the first visible light is blue light, thesecond visible light is green light, and the third visible light is redlight, the second color filter 70 b may be a yellow filter configured toselectively transmit mixed light of the red light and the green light.

In another example, when the first visible light is blue light, thesecond visible light is green light, and the third visible light is redlight, the second color filter 70 b may be a white filter configured toselectively transmit mixed light of the blue light, the green light, andthe red light.

In another example, when the first visible light is green light, thesecond visible light is red light, and the third visible light is bluelight, the second color filter 70 b may be a magenta filter configuredto selectively transmit mixed light of the red light and the blue light.

In another example, when the first visible light is green light, thesecond visible light is red light, and the third visible light is bluelight, the second color filter 70 b may be a white filter configured toselectively transmit mixed light of the blue light, the green light, andthe red light.

The unit color filter array may include at least one first color filter70 a and at least one second color filter 70 b, and herein, the quantityof second color filters 70 b may be the same as or greater than thequantity of first color filters 70 a. In this way, when the quantity ofsecond color filters 70 b configured to selectively transmit mixed lightis the same as or greater than the quantity of first color filters 70 aconfigured to selectively transmit one single light, high sensitivityand high luminance characteristics may be realized by limiting and/orpreventing sharp deterioration of sensitivity and luminance of an imagesensor under a low level light environment.

FIG. 2 is a cross-sectional view showing an image sensor according tosome example embodiments.

Referring to FIG. 2, the image sensor 300 according to some exampleembodiments includes the semiconductor substrate 100 including thephotoelectric device 30; the first and second photo-sensing devices 50 aand 50 b, the charge storage 55, and the transmission transistor (notshown); the color filter layer 70; the lower insulation layer 60; andthe upper insulation layer 80 like the image sensor of the aboveembodiment.

In some example embodiments, the first and second photo-sensing devices50 a and 50 b are formed deep from the surface of the semiconductorsubstrate 110. Since the first photo-sensing device 50 a and the secondphoto-sensing device 50 b may sense light in different wavelengthregions out of a visible ray region depending on a stacking depth, thefirst photo-sensing device 50 a and the second photo-sensing device 50 bmay be variously positioned depending on the wavelength regions.

FIG. 3, FIG. 4, FIG. 5, and FIG. 6 are schematic views respectivelyshowing various examples of a unit color filter array in an image sensoraccording to some example embodiments.

Referring to FIG. 3, the unit color filter array according to someexample embodiments may have a 2×2 matrix format and consist of twofirst color filters 70 a and two second color filters 70 b.

Referring to FIG. 4, the unit color filter array according to someexample embodiments may have a 2×2 matrix format and consist of onefirst color filter 70 a and three second color filters 70 b.

Referring to FIG. 5, the unit color filter array according to someexample embodiments may have a 3×3 matrix format and consist of fourfirst color filters 70 a and five second color filters 70 b.

Referring to FIG. 6, the unit color filter array according to someexample embodiments may have a 3×3 matrix format and consist of threefirst color filters 70 a and six second color filters 70 b.

The first photo-sensing device 50 a overlaps with the first color filter70 a, and the second photo-sensing device 50 b overlaps with the secondcolor filter 70 b.

The first photo-sensing device 50 a may sense light passing thephotoelectric device 30 and the first color filter 70 a. In other words,the first visible light out of the incident light may be absorbed in thephotoelectric device 30, and the second visible light passing the firstcolor filter 70 a out of light passing the photoelectric device 30except for the first visible light may be sensed by the firstphoto-sensing device 50 a.

The second photo-sensing device 50 b may sense light passing thephotoelectric device 30 and the second color filter 70 b. In otherwords, the first visible light out of the incident light may beselectively absorbed in the photoelectric device 30, and mixed lightpassing the photoelectric device 30 except for the first visible lightmay be sensed by the second photo-sensing device 50 b.

The mixed light sensed by the second photo-sensing device 50 b may bethe same as or different from the mixed light passing the second colorfilter 70 b.

For example, when the second color filter 70 b passes the mixed lightincluding the first visible light, the mixed light sensed by the secondphoto-sensing device 50 b may be different from the mixed light passingthe second color filter 70 b.

In another example, when the first visible light absorbed in thephotoelectric device 30 is red light, and the second color filter 70 bis a white filter configured to selectively transmit red light, greenlight, and blue light, the second photo-sensing device 50 b may sensemixed light of the blue light and the green light, that is, cyan light.

In another example, when the first visible light absorbed in thephotoelectric device 30 is blue light, and the second color filter 70 bis a white filter configured to selectively transmit red light, greenlight, and blue light, the second photo-sensing device 50 b may sensemixed light of the red light and the green light, that is, yellow light.

In another example, when the mixed light passing the second color filter70 b includes no first visible light, the mixed light sensed by thesecond photo-sensing device 50 b may be the same as the mixed lightpassing the second color filter 70 b.

In another example, when the first visible light absorbed in thephotoelectric device 30 is red light, and the second color filter 70 bis a cyan filter configured to selectively transmit mixed light of bluelight and green light, the second photo-sensing device 50 b may sensemixed light of the blue light and the green light, that is, cyan light.

In another example, when the first visible light absorbed in thephotoelectric device 30 is blue light, and the second color filter 70 bis a yellow filter configured to selectively transmit mixed light of redlight and green light, the second photo-sensing device 50 b may sensethe mixed light of red light and green light, that is, yellow light.

FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 12, FIG. 13, FIG. 14,FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, FIG. 20, FIG. 21, and FIG.22 are respectively schematic views showing disposition examples of aphotoelectric device and a color filter layer in an image sensoraccording to some example embodiments. FIG. 7, FIG. 8, FIG. 9, FIG. 10,FIG. 11, FIG. 12, FIG. 13, and FIG. 14 show a unit pixel group having a2×2 matrix format, and FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, FIG.20, FIG. 21, and FIG. 22 show a unit pixel group having a 3×3 matrixformat, but the embodiments are not limited thereto.

Referring to FIG. 7, an image sensor according to some exampleembodiments may include a red photoelectric device (R) formed on thewhole surface and thus selectively absorbing and sensing red light andthe color filter layer 70 including at least one blue filter (B)configured to selectively transmit blue light, and at least one whitefilter (W) configured to selectively transmit mixed light of blue light,red light, and green light in a 2×2 matrix format. The quantity of bluefilters (B) may be the same as the quantity of white filters (W).Herein, the first photo-sensing device 50 a overlapping with the bluefilter (B) may sense blue light passing the photoelectric device 30 andthe blue filter (B), and the second photo-sensing device 50 boverlapping with the white filter (W) may sense mixed light of bluelight and green light, that is, cyan light passing the photoelectricdevice 30 and the white filter (W).

Referring to FIG. 8, the image sensor according to some exampleembodiments may include the red photoelectric device (R) formed in thewhole surface and selectively absorbing and sensing red light and thecolor filter layer 70 including at least one blue filter (B) configuredto selectively transmit blue light and at least one white filter (W)configured to selectively transmit mixed light of blue light, red light,and green light in a 2×2 matrix format. The quantity of white filters(W) is greater than the quantity of blue filters (B). Herein, the firstphoto-sensing device 50 a overlapping with the blue filter (B) may senseblue light passing the photoelectric device 30 and the blue filter (B),and the second photo-sensing device 50 b overlapping with the whitefilter (W) may sense mixed light of blue light and green light, that is,cyan light, passing the photoelectric device 30 and the white filter(W).

Referring to FIG. 9, the image sensor according to some exampleembodiments may include the red photoelectric device (R) formed in thewhole surface and selectively absorbing and sensing red light and thecolor filter layer 70 including at least one blue filter (B) configuredto selectively transmit blue light and at least one cyan filter (Cy)configured to selectively transmit mixed light of blue light and greenlight in a 2×2 matrix format. The quantity of blue filters (B) is thesame as the quantity of cyan filters (Cy). Herein, the firstphoto-sensing device 50 a overlapping with the blue filter (B) may senseblue light passing the photoelectric device 30 and the blue filter (B),and the second photo-sensing device 50 b overlapping with the cyanfilter (Cy) may sense mixed light of blue light and green light, thatis, cyan light passing the photoelectric device 30 and the cyan filter(Cy).

Referring to FIG. 10, the image sensor according to some exampleembodiments may include the red photoelectric device (R) selectivelyabsorbing and sensing red light and the color filter layer 70 includingat least one blue filter (B) configured to selectively transmit bluelight and at least one cyan filter (Cy) configured to selectivelytransmit mixed light of blue light and green light in a 2×2 matrixformat. The quantity of cyan filters (Cy) is greater than the quantityof blue filters (B). Herein, the first photo-sensing device 50 aoverlapping with the blue filter (B) may sense blue light passing thephotoelectric device 30 and the blue filter (B), and the secondphoto-sensing device 50 b overlapping with the cyan filter (Cy) maysense mixed light of blue light and green light, that is, cyan lightpassing the photoelectric device 30 and the cyan filter (Cy).

Referring to FIG. 11, the image sensor according to some exampleembodiments may include a blue photoelectric device (B) formed on thewhole surface and selectively absorbing and sensing blue light and thecolor filter layer 70 including at least one red filter (R) configuredto selectively transmit red light and at least one white filter (W)configured to selectively transmit mixed light of blue light, red light,and green light in a 2×2 matrix format. The quantity of red filters (R)is the same as the quantity of white filters (W). Herein, the firstphoto-sensing device 50 a overlapping with the red filter (R) may sensered light passing the photoelectric device 30 and the red filter (R),and the second photo-sensing device 50 b overlapping with the whitefilter (W) may sense mixed light of red light and green light, that is,cyan light passing the photoelectric device 30 and the white filter (W).

Referring to FIG. 12, the image sensor according to some exampleembodiments may include the blue photoelectric device (B) formed on thewhole surface and selectively absorbing and sensing blue light and thecolor filter layer 70 including at least one red filter (R) configuredto selectively transmit red light and at least one white filter (W)configured to selectively transmit mixed light of blue light, red light,and green light in a 2×2 matrix format. The quantity of white filters(W) is greater than the quantity of red filters (R). Herein, the firstphoto-sensing device 50 a overlapping with the red filter (R) may sensered light passing the photoelectric device 30 and the red filter (R),and the second photo-sensing device 50 b overlapping with the whitefilter (W) may sense mixed light of red light and green light, that is,yellow light passing the photoelectric device 30 and the white filter(W).

Referring to FIG. 13, the image sensor according to some exampleembodiments may include the blue photoelectric device (B) formed on thewhole surface and selectively absorbing and sensing blue light and thecolor filter layer 70 including at least one red filter (R) configuredto selectively transmit red light and at least one yellow filter (Y)configured to selectively transmit mixed light of red light and greenlight in a 2×2 matrix format. The quantity of red filters (R) is thesame as the quantity of yellow filters (Y). Herein, the firstphoto-sensing device 50 a overlapping with the red filter (R) may sensered light passing the photoelectric device 30 and the red filter (R),and the second photo-sensing device 50 b overlapping with the yellowfilter (Y) may sense mixed light of red light and green light, that is,yellow light passing the photoelectric device 30 and the yellow filter(Y).

Referring to FIG. 14, the image sensor according to some exampleembodiments may include the blue photoelectric device (B) formed on thewhole surface and selectively absorbing and sensing blue light and thecolor filter layer 70 including at least one red filter (R) configuredto selectively transmit red light and at least one yellow filter (Y)configured to selectively transmit mixed light of red light and greenlight in a 2×2 matrix format. The quantity of yellow filters Y isgreater than the quantity of red filters (R). Herein, the firstphoto-sensing device 50 a overlapping with the red filter (R) may sensered light passing the photoelectric device 30 and the red filter (R),and the second photo-sensing device 50 b overlapping with the yellowfilter (Y) may sense mixed light of red light and green light, that is,yellow light passing the photoelectric device 30 and the yellow filter(Y).

Referring to FIG. 15 and FIG. 16, the image sensor according to someexample embodiments may include the red photoelectric device (R) formedon the whole surface and selectively absorbing and sensing red light andthe color filter layer 70 including at least one blue filter (B)configured to selectively transmit blue light and at least one whitefilter configured to selectively transmit mixed light of blue light, redlight, and green light in a 3×3 matrix format. The quantity of whitefilters (W) is greater than the quantity of blue filters (B). Herein,the first photo-sensing device 50 a overlapping with the blue filter (B)may sense blue light passing the photoelectric device 30 and the bluefilter (B), and the second photo-sensing device 50 b overlapping withthe white filter (W) may sense mixed light of blue light and greenlight, cyan light, passing the photoelectric device 30 and the whitefilter (W).

Referring to FIG. 17 and FIG. 18, the image sensor according to someexample embodiments may include the red photoelectric device (R) formedon the whole surface and selectively absorbing and sensing red light andthe color filter layer 70 including at least one blue filter (B)configured to selectively transmit blue light and at least one cyanfilter (Cy) configured to selectively transmit mixed light of blue lightand green light in a 3×3 matrix format. The quantity of cyan filters(Cy) is greater than the quantity of blue filters (B). Herein, the firstphoto-sensing device 50 a overlapping with the blue filter (B) may senseblue light passing the photoelectric device 30 and the blue filter (B),and the second photo-sensing device 50 b overlapping with the cyanfilter (Cy) may sense mixed light of blue light and green light, cyanlight passing the photoelectric device 30 and the cyan filter (Cy).

Referring to FIG. 19 and FIG. 20, the image sensor according to someexample embodiments may include the blue photoelectric device (B) formedon the whole surface and selectively absorbing and sensing blue lightand the color filter layer 70 including at least one red filter (R)configured to selectively transmit red light and at least one whitefilter (W) configured to selectively transmit mixed light of red light,green light, and blue light in a 3×3 matrix format. The quantity ofwhite filters (W) is greater than the quantity of red filters (R).Herein, the first photo-sensing device 50 a overlapping with the redfilter (R) may sense red light passing the photoelectric device 30 andthe red filter (R), and the second photo-sensing device 50 b overlappingwith the white filter (W) may sense mixed light of red light and greenlight, that is, yellow light passing the photoelectric device 30 and thewhite filter (W).

Referring to FIG. 21 and FIG. 22, the image sensor according to someexample embodiments may include the blue photoelectric device (B) formedon the whole surface and selectively absorbing and sensing blue lightand the color filter layer 70 including at least one red filter (R)configured to selectively transmit red light and at least one yellowfilter (Y) configured to selectively transmit mixed light of red lightand green light in a 3×3 matrix format. The quantity of yellow filters(Y) is greater than the quantity of red filters (R). Herein, the firstphoto-sensing device 50 a overlapping with the red filter (R) may sensered light passing the photoelectric device 30 and the red filter (R),and the second photo-sensing device 50 b overlapping with the yellowfilter (Y) may sense mixed light of red light and green light, that is,yellow light passing the photoelectric device 30 and the yellow filter(Y).

The image sensor according to some example embodiments has a structurethat the photo-sensing device and the photoelectric device are stackedand thus may have a reduced area and be down-sized.

In addition, the image sensor according to some example embodimentsincludes a color filter configured to selectively transmit mixed lightand thus may decrease a light loss due to the color filter and increaselight absorption efficiency. Accordingly, a highly sensitive imagesensor may be realized.

The image sensor according to some example embodiments shown in FIG. 7,FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 12, FIG. 13, FIG. 14, FIG. 15,FIG. 16, FIG. 17, FIG. 18, FIG. 19, FIG. 20, FIG. 21, and FIG. 22 may becompared with a conventional non-stacked image sensor of 2×2 and 3×3matrix formats to evaluate improvement of light absorption efficiency.

FIG. 23 and FIG. 24 show examples of disposing a color filter layer inthe conventional non-stacked image sensor of 2×2 and 3×3 matrix formats.

The light absorption efficiency is evaluated through relative comparisonas follows.

1) Incident light entering a unit pixel is regarded to be 1.

2) Since a color filter such as a red filter, a green filter, and a bluefilter passes ⅓ of the incident light, light sensed in a photo-sensingdevice of the unit pixel is regarded to be ⅓.

3) Since the photoelectric device selectively absorbs red, green, orblue light, light absorbed in the photoelectric device is regarded to be⅓.

4) Since a mixed filter absorbs two or three colors except for lightabsorbed in the photoelectric device, light sensed in a photo-sensingdevice of the unit pixel is regarded to be ⅔. In other words, when thephotoelectric device absorbing a first visible light is overlapping witha white filter, light sensed in the photo-sensing device of the unitpixel is light except for the first visible light out of the incidentlight and thus regarded to be ⅔. Likewise, when the photoelectric deviceabsorbing a first visible light is overlapping with a mixing filterconfigured to selectively transmit and mixing mixed light except for thefirst visible light, that is, a cyan filter or a yellow filter, lightsensed in the photo-sensing device of the unit pixel is regarded to be ⅔out of the incident light.

5) A relative ratio is calculated based on 100% of light absorptionefficiency of Reference examples 1 and 2.

The results are provided in Table 1.

TABLE 1 Light absorbance Relative Structure maximum 1 ratio (%)Reference FIG. 23 1/3 100 example 1 2 × 2 Reference FIG. 24 1/3 100example 2 3 × 3 Example 2 × 2 FIG. 7, 11 10/12 250 FIG. 8, 12 11/12 275FIG. 9, 13 10/12 250 FIG. 10, 14 11/12 275 Example 3 × 3 FIG. 15, 19 8/9267 FIG. 16, 20 23/27 256 FIG. 17, 21 8/9 267 FIG. 18, 22 23/27 256

Referring to Table 1, the image sensor according to some exampleembodiments shown in FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 12,FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, FIG. 20,FIG. 21, and FIG. 22 is expected to show greater than or equal to twicehigher light absorption efficiency than the conventional non-stackedimage sensors according to Reference examples 1 and 2. Accordingly, ahighly-sensitive image sensor may be realized.

FIG. 25 shows an image sensor that includes multiple arrays of colorfilters according to some example embodiments.

In some example embodiments, an image sensor may include multiple arraysof color filters included in the example embodiments, where at least twoof the arrays include different arrays of color filters. In the exampleembodiment illustrated in FIG. 25, for example, an image sensor 2500includes an array of color filter arrays 2510-1 to 2510-N. Each array ofcolor filters 2510-1, 2510-2, 2510-3, 2510-N includes a separate,respective array of color filters 2520. In some example embodiments, theimage sensor 2500 includes a common photoelectric device 30 that extendsover each of the color filter arrays 2510-1 to 2510-N.

As shown in FIG. 25, each of the color filter arrays 2510-1 to 2510-Nmay include a different configuration of color filters. As shown, forexample, where image sensor 2500 includes a single photoelectric device30 that is configured to selectively sense red color light and extendsover each of the color filter arrays 2510-1 to 2510-N, color filterarray 2510-1 includes a 2×2 array of two blue color filters 2520 and twocyan color filters 2520, color filter array 2510-2 includes a 2×2 arrayof two blue color filters 2520 and two white color filters 2520, colorfilter array 2510-3 includes a 2×2 array of one blue color filter 2520and three cyan color filters 2520, and color filter array 2510-Nincludes a 2×2 array of one blue color filter 2520 and three white colorfilters 2520.

It will be understood that some example embodiments of the image sensor2500 may include larger color filter arrays (“arrays of color filters”)2510-1 to 2510-N, including at least a 3×3 array. Some exampleembodiments of the image sensor 2500 may include multiple photoelectricdevices 30 that are each one separate sets of color filter arrays 2510-1to 2510-N.

It will be understood that the color filters in the color filter arrays2510-1 to 2510-N and 2520-1 to 2520-N are on separate photo-sensingdevices, including one or more of the photo-sensing devices 50 a and 50b shown in FIG. 1 and FIG. 2. The image sensor 2500 may generate imagesbased on information generated by the photoelectric device 30 and thephoto-sensing devices on which the color filters of the color filterarrays 2510-1 to 2510-N and 2520-1 to 2520-N are located. Each of thecolor filter arrays 2510-1 to 2510-N and 2520-1 to 2520-N may be on aseparate corresponding array of photo-sensing devices.

An image sensor 2500 that includes different color filter arrays onseparate arrays of photo-sensing devices and different photoelectricdevices may have improved average light absorption efficiency andsensitivity due to being configured to generate images via informationgenerated by different photo-sensing devices and photoelectric devicesexposed to a common illumination environment. Some photoelectric devicesand photo-sensing devices may be configured to provide improved lightabsorption efficiency and sensitivity than other image sensors undervarious illumination environments. The image sensor 2500 may beconfigured to mitigate light absorption efficiency and sensitivitydeficiencies that may be present in any one particular photoelectricdevice and photo-sensing device from contributing to an overalldeterioration in average light absorption efficiency and sensitivity ofthe image sensor 2500. In addition, when at least one array ofphoto-sensing devices overlapping a corresponding color filter array2510-1 is configured to provide enhanced light absorption efficiency andsensitivity under particular illumination environments where at leastone other array of photo-sensing devices overlapping anothercorresponding color filter array 2520-1 provides degraded lightabsorption efficiency and sensitivity under the same particularillumination environments, the at least one array of photo-sensingdevices overlapping the corresponding color filter array 2510-1 maynegate any overall degradation in average light absorption efficiencyand sensitivity of the image sensor 2500 under the particularillumination environments.

FIG. 26 shows an image sensor that includes multiple arrays of colorfilters and multiple photoelectric devices according to some exampleembodiments.

In some example embodiments, an image sensor may include multiple,different photoelectric devices on separate sets of color filter arrays.In the example embodiment illustrated in FIG. 26, for example, an imagesensor 2600 includes separate photoelectric devices 30-1 to 30-N onseparate sets 2602-1 to 2602-N of color filter arrays 2610-1 to 2610-Nand 2620-1 to 2620-N.

For example, the image sensor 2600 illustrated in FIG. 26 includes aphotoelectric device 30-1 that is configured to selectively sense redcolor light, and the photoelectric device 30-1 is on a set 2602-1 ofcolor filter arrays 2610-1 to 2610-N, such that each of the color filterarrays 2610-1 to 2610-N may receive light from a photoelectric device30-1 that includes a red color filter.

In addition, the image sensor 2600 illustrated in FIG. 26 includes aphotoelectric device 30-N that is configured to selectively sense bluecolor light, and the photoelectric device 30-N is on a set 2602-2 ofcolor filter arrays 2620-1 to 2620-N, such that each of the color filterarrays 2620-1 to 2620-N may receive light from a photoelectric device30-N that includes a blue color filter.

As shown in FIG. 26, each of the color filter arrays 2610-1 to 2610-Nand 2620-1 to 2620-N may include different sets of color filters 2605.The color filters 2605 that may be included in a given color filterarray may be based on the color selectively sensed by the respectivephotoelectric device 30-1 to 30-N that is on the respective color filterarray.

As shown in FIG. 26, for example, where image sensor 2600 includes aphotoelectric device 30-1 that includes a red color filter and extendsover each of the color filter arrays 2610-1 to 2610-N, color filterarray 2610-1 includes a 2×2 array of two blue color filters 2605 and twocyan color filters 2605 and color filter array 2610-N includes a 2×2array of two blue color filters 2605 and two white color filters 2605.

In addition, where image sensor 2600 includes a photoelectric device30-N that includes a blue color filter and extends over each of thecolor filter arrays 2620-1 to 2620-N, color filter array 2620-1 includesa 2×2 array of two red color filters 2605 and two yellow color filters2605 and color filter array 2620-N includes a 2×2 array of two red colorfilters 2605 and two white color filters 2605.

It will be understood that, where a photoelectric device selectivelysenses a first wavelength spectrum of light, the photoelectric devicemay be on a color filter array that includes a quantity of color filtersconfigured to selectively transmit at least one of a second wavelengthspectrum of light, a third wavelength spectrum of light, and a fourthwavelength spectrum of light. For example, photoelectric devices 30-1and 30-N shown in FIG. 26 may be configured to selectively sense firstand second wavelengths of light, respectively. The color filter array2610-1 may include at least one color filter configured to selectivelytransmit the second wavelength spectrum of light and a third wavelengthspectrum of light. The third wavelength spectrum of light may includethe second wavelength spectrum of light. In addition, the color filterarray 2620-1 may include at least one color filter configured toselectively transmit the first wavelength spectrum of light and at leastone color filter configured to selectively transmit a fourth wavelengthspectrum of light. The fourth wavelength spectrum of light may includethe first wavelength spectrum of light.

It will be understood that some example embodiments of the image sensor2600 may include larger arrays color filters, including at least a 3×3array.

It will be understood that the color filters in the color filter arrays2610-1 to 2610-N and 2620-1 to 2620-N are on separate photo-sensingdevices, including one or more of the photo-sensing devices 50 a and 50b shown in FIG. 1 and FIG. 2. The image sensor 2600 may generate imagesbased on information generated by the photoelectric devices 30-1 to 30-Nand the photo-sensing devices on which the color filters of the colorfilter arrays 2610-1 to 2610-N and 2620-1 to 2620-N are located. Each ofthe color filter arrays 2610-1 to 2610-N and 2620-1 to 2620-N may be ona separate corresponding array of photo-sensing devices.

An image sensor 2600 that includes different color filter arrays onseparate arrays of photo-sensing devices and different photoelectricdevices may have improved average light absorption efficiency andsensitivity due to being configured to generate images via informationgenerated by different photo-sensing devices and photoelectric devicesexposed to a common illumination environment. Some photoelectric devicesand photo-sensing devices may be configured to provide improved lightabsorption efficiency and sensitivity than other image sensors undervarious illumination environments. The image sensor 2600 may beconfigured to mitigate light absorption efficiency and sensitivitydeficiencies that may be present in any one particular photoelectricdevice and photo-sensing device from contributing to an overalldeterioration in average light absorption efficiency and sensitivity ofthe image sensor 2600. In addition, when at least one array ofphoto-sensing devices overlapping a corresponding color filter array2610-1 is configured to provide enhanced light absorption efficiency andsensitivity under particular illumination environments where at leastone other array of photo-sensing devices overlapping anothercorresponding color filter array 2620-1 provides degraded lightabsorption efficiency and sensitivity under the same particularillumination environments, the at least one array of photo-sensingdevices overlapping the corresponding color filter array 2610-1 maynegate any overall degradation in average light absorption efficiencyand sensitivity of the image sensor 2600 under the particularillumination environments.

It should be understood that example embodiments described herein shouldbe considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each device ormethod according to example embodiments should typically be consideredas available for other similar features or aspects in other devices ormethods according to example embodiments. While some example embodimentshave been particularly shown and described, it will be understood by oneof ordinary skill in the art that variations in form and detail may bemade therein without departing from the spirit and scope of the claims.

What is claimed is:
 1. An image sensor comprising a semiconductorsubstrate including a plurality of photo-sensing devices, aphotoelectric device on the semiconductor substrate and configured toselectively sense a first visible light, the first visible lightincluding light in a first wavelength spectrum; and a plurality of colorfilters on the plurality of photo-sensing devices, each of the colorfilters being on a separate photo-sensing device of the plurality ofphoto-sensing devices, the plurality of color filters including a firstcolor filter configured to selectively transmit second visible light,the second visible light including light in a second wavelengthspectrum, the second wavelength spectrum being different from the firstwavelength spectrum, and a second color filter configured to transmit afirst mixed light, the first mixed light including light in the secondwavelength spectrum and light in a third wavelength spectrum, the thirdwavelength spectrum being different from the second wavelength spectrum;wherein the plurality of photo-sensing devices includes a firstphoto-sensing device overlapping with the first color filter andconfigured to sense the second visible light, and a second photo-sensingdevice overlapping with the second color filter and configured to sensea second mixed light, the second mixed light including the secondvisible light.
 2. The image sensor of claim 1, wherein the plurality ofcolor filters includes a color filter array, the color filter arrayincluding a quantity of first color filters and a quantity of secondcolor filters, the quantity of first color filters includes at least onefirst color filter, the quantity of second color filters includes atleast one second color filter, and the quantity of second color filtersis equal to or greater than the quantity of first color filters.
 3. Theimage sensor of claim 1, wherein the second mixed light and the firstmixed light have a common wavelength spectrum, and each of the firstmixed light and the second mixed light excludes the first visible light.4. The image sensor of claim 3, wherein each of the first mixed lightand the second mixed light includes at least one of a mixture of bluelight and green light, and a mixture of red light and green light. 5.The image sensor of claim 1, wherein the first mixed light includes thefirst visible light, and the second mixed light excludes the firstvisible light.
 6. The image sensor of claim 5, wherein each of the firstmixed light and the second mixed light includes green light.
 7. Theimage sensor of claim 5, wherein the first mixed light includes amixture of red light, green light, and blue light, and the second mixedlight includes at least one of a mixture of blue light and green light,and a mixture of red light and green light.
 8. The image sensor of claim1, wherein the second visible light includes blue light, and the secondmixed light includes a mixture of blue light and green light.
 9. Theimage sensor of claim 1, wherein the second visible light includes redlight, and the second mixed light includes a mixture of red light andgreen light.
 10. The image sensor of claim 1, wherein the firstphoto-sensing device has a first thickness, the second photo-sensingdevice has a second thickness, and the first thickness is different fromthe second thickness.
 11. The image sensor of claim 10, wherein thesecond thickness is greater than the first thickness.
 12. The imagesensor of claim 1, wherein the first visible light includes at least oneof red light and blue light.
 13. The image sensor of claim 12, whereinthe first visible light includes red light and the second visible lightincludes blue light.
 14. The image sensor of claim 12, wherein the firstvisible light includes blue light and the second visible light includesred light.
 15. The image sensor of claim 1, wherein the first mixedlight includes a mixed light, the mixed light including at least thefirst visible light.
 16. The image sensor of claim 1, wherein the firstmixed light includes a mixed light, the mixed light including red light,green light, and blue light.
 17. The image sensor of claim 1, whereinthe first mixed light includes a mixed light, the mixed light excludingthe first visible light.
 18. The image sensor of claim 1, wherein thephotoelectric device includes a pair of electrodes, the electrodesfacing each other, and a light absorption layer between the pair ofelectrodes, the light absorption layer being configured to selectivelyabsorb the first visible light.
 19. An electronic device comprising theimage sensor of claim
 1. 20. An image sensor, comprising: at least firstand second arrays of photo-sensing devices; at least first and secondarrays of color filters on separate, respective ones of the first andsecond arrays of photo-sensing devices, the second array of colorfilters including a different configuration of color filters from thefirst array of color filters, each array of color filters including atleast two color filters configured to selectively transmit at least twoseparate wavelength spectra of light; and at least one photoelectricdevice on the first and second arrays of color filters, the at least onephotoelectric device being configured to selectively sense a wavelengthspectrum of light that is different from the at least two separate lightwavelength spectra of light.
 21. The image sensor of claim 20, whereinthe at least one photoelectric device includes first and secondphotoelectric devices on separate, respective ones of the first andsecond arrays of color filters, the first and second photoelectricdevices being configured to selectively sense different wavelengthspectra of light.
 22. The image sensor of claim 21, wherein the firstarray of color filters includes a quantity of first color filters and aquantity of second color filters; the second plurality of filtersincludes a second color filter array; and the second color filter arrayincludes at least a quantity of third color filters.
 23. The imagesensor of claim 22, wherein the second color filter array includes aquantity of second color filters.
 24. The image sensor of claim 22,wherein the second color filter array includes a quantity of fourthcolor filters.